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This machine is used to mill the cavity on standard card and embed different kinds of chips into the milled cavity.
1. Integration of cavities milling, vacuum cleaning, cavity detection, glue tape punching, lamination, module tape punching, module embedding and ATR testing.
2. Specialized fixture design for card centering system, protecting the milling depth from the influences of the card thickness and dimension.
3. Milling program can be designed by operator, cavity layer can be set 3 layers, each program can be save individually.
4. X and Y the two separated milling stations can mill different profiles at the same time, or individually. It settles difficult problem of adjusting the center place on two stations while milling.
5. Z-Axis moving is realized through guide and ball screw driven by high precision servo motor, to provide the accurate milling depth. Special tool changing program make tool changing is fast and convenient.
6. Depth detection device, double card detection device, card direction detection device and card correction functions.
7. Cards transferred through belt driven by servo motor ensure the safety and stability of the machine.
8. Film loading is controlled by serve motor with sensor detection. Faulty module can be distinguished automatically.
9. IC tape feeding and collecting automatically.
10. Bad chips rejected automatically.
11. Special pick up module structure which ensure module without damage.
12. Module punching tool positioning by dowel pin.
13. Strip IC stepping is controlled by servo motor, feeding distance can be adjusted by parameter, and module has double protection with photoelectric sensor monitoring.
14. Servo motor working with high precision guider and lead screw makes module transfer more stable and reliable. Module transfer position can be changed easily.
15. Special design for hot press station makes sure module sticking to plastic card tightly. It is convenient to change the hot pressers.
16. ATR test system ensures qualified rate of embedding.
17. Machine no embedding without chip on the card.
18. Each chip hot welding three times
19. Hot welding head, cold welding head all have water cooling function, ensure embedding quality.
20. Hot welding head have X & Y direction fine adjustment function.
21. ATR checking before card collecting, bad card will be rejected automatically.
22. Special feeding design avoids unloading double cards caused by static electricity.
23. With chip lamination function.
26. IC conveying and pre-welding at the same time.
Dimension： Approx L2000 x W1000 x H1520 (mm)
Weight ： Approx1500 kg
1）Embedding position tolerance：±0.05mm
2）Embedding flatness tolerance：+0.05mm，-0.1mm
3）Milling position tolerance：±0.05mm
4) Milling size tolerance：±0.02mm；
5) Milling depth accuracy：±0.015mm；
6) Module punching accuracy：±0.05mm；
7) Glue tape punching accuracy：±0.05mm；
8) Hot welding head temperature:
a. Temperature adjusting range：25℃～250℃；
b. Different range between real temperature of Hot welding head and display temperature on machine is±5℃.
Applicable materials: different kinds of chips and ISO standard cards.
Output rate： About 3000~3500cards/h( for milling 2 layers)
About 2000 cards/h( for milling 3 layers)
Product percent of pass： 99.8%
Add：Building B, Hongxing Xifang Industrial Park,Datianyang,
Songyu Road, Songgang Street,Bao'An District,
Shenzhen, 518105, China
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