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Full Auto RFID Flip Chip Assembling Machine - WModel:YMJ-WB-30K

Full auto RFID Flip Chip Assembling Machine adopt the flip chip on board technology to produce the RFID inlays, through high-precision modular mechanism, pick the chip from wafer,  then place on pre-dispensing conductive glue with hot press, solidify wafer on the etched antenna, to conduct chip and substrate antenna, so that achieve RFID Inlay bonding.  Precise vision system make sure accurately positioning and monitor the RFID chip and antenna bonding. Integrate with glue dispensing, chip pick and placement, transportation, hot press, testing and unloading.


Product Detail

Technical parameters:

Overall Dimension

About L 6500*W 1280*H 1950 mm

Weight

About 2800kg

Power Supply

AC 220V 50/60Hz

Power

18KW

Air Pressure

6KG/CM²

Control

PC

Width of Material

50~400 mm

Bonding Accuracy

±0.02~0.03mm

Applicable Material

 PET, PVC, paper

Specification of Wafer Ring

8"/12"

Chip Size

0.2X0.2~2.0X2.0 mm

Outer Diameter of Core

Max. 600mm

Inner Diameter of Core

76mm

UPH

About 15K pcs/Hr

Pass Rate

About 99.99%

 







Product Video
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Tel:+86-755-27918093/23060983
Fax:+86-755-27918086
Add:Building B, Hongxing Xifang Industrial Park,Datianyang,

          Songyu Road, Songgang Street,Bao'An District,

          Shenzhen, 518105, China


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